Technical Aspects

Technical Capabilities

No. of Layers Up to 8 Layers
Minimum Annular Ring 0.25 mm
Min. Finished Via Hole Size 0.25 mm
Max Board Size 400 x 500 mm
Min. Board Thickness 0.25 mm
Max. Board Thickness 3.25 mm
Drill to Drill Clearance 0.25 mm
Minimum Clearance b/w Traces 0.25 mm
Minimum Trace Width 0.15 mm

Surface Finish

  • HASL (Lead Free & Pb/Sn)
  • Electrolytic Gold
  • Immersion Silver
  • Immersion Tin

Tolerances

  • PCB Size: +/- 0.25 mm
  • PCB Thickness: +/- 10%
  • Copper Thickness Inside Hole: +/- 0.25 mm